ATFIN CU S is specially designed to form a protective colorless film on the surface of copper or copper alloys.
The benefit of this product :
- Operation is easy and the film is formed very fast.
- Water soluble, nonpoisonous and nonirritant.
- Solderability and contact resistance of the film are not affected.
- Effectively prevent copper or copper alloys from eroded by water, air, oxygen, gas, etc.